This paper proposes a ternary signalling scheme for inductive coupling links (ICLs) in 3D-integrated circuits (3D-ICs) to reduce crosstalk and electromagnetic interference in multi-stacked chip communications. By converting binary data into ternary sequences with three voltage levels (-V, 0V, +V), the approach enhances signal separation, reduces crosstalk, and improves signal integrity. Unlike traditional Non-Return to Zero (NRZ) systems, the ternary scheme increases bandwidth efficiency and reduces power consumption through fewer signal transitions. A modified H-Bridge transmitter generates ternary symbols by controlling current flow based on binary-to-ternary mapping. Preliminary simulations validate the efficiency of the scheme, showing reduced power consumption and higher data rates compared to NRZ. This approach shows promise for high-performance computing and IoT devices in 3D-IC environments, offering enhanced noise resilience, lower power usage, and improved communication efficiency.